《集成电路封装材料的表征(英文)》的主要内容包括: Foreword;Preface to the Reissue of the Materials Characterization Series xiii;Preface to Series xiv;Preface to the Reissue of Integrated Circuit Packaging Materials xv;Preface xvi;Contributors xix等。
目录
Foreword xi Preface to the Reissue of the Materials Characterization Series xiii Preface to Series xiv Preface to the Reissue of Integrated Circuit Packaging Materials xv Preface xvi Contributors xix IC PACKAGE RELIABILITY TESTING MOLD COMPOUND ADHESION AND STRENGTH MECHANICAL STRESS IN IC PACKAGES MOISTURE SENSITMTY AND DELAMINATION THERMAL MANAGEMENT ELECTRICAL PERFORMANCE OF IC PACKAGES SOLDERABILITY OF INTEGRATED CIRCUITS HERMETICITY AND JOINING IN CERAMIC IC PACKAGES ADVANCED INTERCONNECT TECHNOLOGY APPENDIX: TECHNIQUE SUMMARIES