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Yangyuan Wang，Yuhua Cheng 著

圖書標籤:

• Microelectronics
• Nanoelectronics
• Green Electronics
• Sustainable Technology
• Low Power Design
• Emerging Technologies
• Materials Science
• Device Physics
• Energy Efficiency
• Environmental Impact

店鋪： 博學精華圖書專營店

齣版社： 科學齣版社

ISBN：9787030363312

商品編碼：29720800156

包裝：精裝

齣版時間：2013-05-01

基本信息

書名:Green Micro/Nano Electronics

定價：218.00元

售價：148.2元,便宜69.8元,摺扣67

作者:Yangyuan Wang、Yuhua Cheng、Min-hwa Chi

齣版社：科學齣版社

齣版日期：2013-05-01

ISBN：9787030363312

字數：

頁碼：

版次：1

裝幀：精裝

開本：16開

商品重量：1.562kg

編輯推薦

　　《綠色微納電子學(Green Micro\NanoElectronics)》首先提齣瞭“綠色微納電子學”的概念，並分彆從能源經濟、社會文化、低功耗集成電路設計、綠色集成電路芯片製造、綠色電子封裝、微納電子新器件結構、綠色存儲器的發展和集成微納係統(M／NEMS)等各個角度對綠色微納電子學進行瞭闡述，介紹瞭在這些方麵國內外學術界和工業界的**進展；此外，王陽元還從新能源的應用角度，對半導體綠色照明光源、薄膜太陽能電池等有關領域的發展進行瞭學術探討。本書是全英文版。

內容提要

提齣“綠色微納電子學”的概念，分彆從能源經濟、社會文化、低功耗集成電路設計、綠色集成電路芯片製造、綠色電子封裝、微納電子新器件結構、綠色存儲器的發展和集成微納係統等各個角度對綠色微納電子學進行闡述，介紹這些方麵國內外學術界和工業界的*進展；此外，還從新能源的應用角度，對半導體綠色照明光源、薄膜太陽能電池等有關領域的發展進行瞭學術探討。

目錄

Chapter 1 Energy Resources and Their Roles in Economic and Social Development
1.1 Energy Generation and Reserves
1.1.1 Classifications of Energy Resources
1.1.2 Reserves of Conventional Energy
1.1.3 Reserves of New Energy
1.2 Use and Consumption of Energy
1.2.1 Use and Production of Energy
1.2.2 Energy Consumption in Life and Production
1.3 Energy and Economic Development
1.3.1 Energy as an Important Factor in Pushing Economic Growth
1.3.2 The Negative Impact of Energy Crisis on Economic Growth
1.3.3 Constraint of Population Growth on Energy Development
1.3.4 Constraints of Environmental Pollution on Energy Development
1.4 Policy Guidance and Measures of Saving Energy
1.4.1 Regulations for Environmental Protection
1.4.2 Tax Policy
1.4.3 Major Planning
1.4.4 Important Measures
1.5 Future Development of Integrated Circuits(IC)
1.5.1 Revolutionary Role of IC in Energy Conservation
1.5.2 Future Driving Force of IC Development Is Reducing Power Consumption
References
Chapter 2 Low Power IC Design
2.1 Power Source and Analysis of Integrated Circuits
2.1.1 Static Power
2.1.2 Dynamic Power
2.1.3 Power Analysis
2.1.4 Conclusion
2.2 Circuit-Level Low Power Design
2.2.1 Introduction
2.2.2 RTL-level Low Power Design
2.2.3 Gate-level Low Power Design
2.2.4 Layout-level Low Power Design
2.2.5 Asynchronous Circuit Design
2.2.6 Sub-threshold and Multi-voltage Design
2.2.7 Conclusions
2.3 System-level Low Power Design
2.3.1 Introduction
2.3.2 Dynamic Power Management
2.3.3 Dynamic Voltage Scaling
2.3.4 Low Power Compilation
2.3.5 Low Power Hardware/Software Co-design
2.4 Battery-Aware Low Power Design
2.4.1 Introduction
2.4.2 Battery Model and Battery Discharge Characteristics
2.4.3 Battery-Aware Task Scheduling
2.4.4 Battery-Driven Power Management
2.4.5 Conclusion
2.5 Low Power IC Design and Green IT
2.5.1 Rise of Green IT
2.5.2 Low Power IC Design for Green IT
2.5.3 Conclusion
Reference
Chapter 3 Green Technology for IC Manufacturing
3.1 IC Industry and Environment
3.2 IC manufacturing process introduction
3.3 Modern CMOS Process Flow
3.4 Dry Etching/Cleaning and Greenhouse Gas Emissions
3.4.1 Introduction of Dry Etching
3.4.2 Introduction of Dry Cleaning Process
3.4.3 Process Parameter Optimization
3.4.4 Technology of Exhaust Treatment for Dry and Wet Process
3.5 Wet Etching/Cleaning and Waste Chemicals
3.5.1 Wet Etching
3.5.2 Wet Cleaning in FEOL and BEOL
3.6 Photo-resist Pollution and Control in Lithography Processes
3.6.1 Introduction of Lithography Process and Photo-resist
3.6.2 Background Information on PFOS
3.6.3 Environmental and Health Impacts of Photo-resist
3.6.4 The Importance of PFOS for Lithography Processes
3.6.5 Environmental Friendly Photo-resist Materials
3.6.6 The R & D Trend for Environmental Friendly Photo-resists
3.7 Slurries in CMP and Environmental Considerations
3.7.1 Introduction of CMP Technology
3.7.2 Assessment of Environmental Impact of CMP Slurries
3.7.3 Classification and Characteristics of CMP Slurries
3.7.4 Slurry Disposal
3.7.5 Slurry Storage and Transportation
3.8 IC Manufacturing and Treatment of Waste Chemicals
3.8.1 Common Chemicals in IC Manufacturing
3.8.2 Liquid Chemicals and Waste Water Treatment
3.8.3 Gaseous Chemicals and Exhaust Treatment
3.8.4 Management of Hazardous Substances in IC Manufacturing
3.9 Low Power CMOS Technology for Friendly Environment
3.9.1 CMOS on SOI Technology
3.9.2 High-κ and Metal-gate(HKMG)Technology
3.9.3 Low-κ Interconnection
3.9.4 System-on-chip and System-in-package
3.10 Summary
Acknowledgements
References
Chapter 4 Green Electronic Materials and Advanced Packaging Technologies
4.1 Introduction
4.1.1 Background Information
4.1.2 The Importance of Lead-free Soldering in Green Electronics
4.2 IC Chip Packaging
4.2.1 Packaging Process
4.2.2 Classification of Packages
4.2.3 New Packaging Technologies
4.3 Co-design of Chip-Package-PCB
4.3.1 Challenges of Advanced Packaging
4.3.2 Chip-Package-PCB Co-design Process
4.3.3 Key Issues of Chip-Package-PCB Co-design
4.4 System-in-Package(SIP)and its Applications
4.4.1 Overview
4.4.2 Key Issues of SIP
4.4.3 Applications of SIP
4.5 Three-dimensional Packaging
4.5.1 Overview
4.5.2 Basics of Three-dimensional Packaging
4.5.3 Challenges of Three-dimensional Packaging Technology
4.5.4 Research and Applications of Three-dimensional Packaging
4.5.5 Summary and Development Trends
4.6 Applications of Green Nanoposites in Advanced Packaging
4.7 Selection and Characterization of Solder Alloys for Pb-free Reflow Soldering
4.7.1 Pb-free Solder Paste Materials
4.7.2 Engineering Considerations and Recipe of Selected Solder Paste Materials
4.7.3 Flux
4.7.4 Characterization of Selected Solder Paste Materials
4.8 Board Level Reliability Test
4.8.1 Sample Description
4.8.2 Solder and Intermetallic Analysis after Reflow
4.8.3 Accelerated Thermal Cycling Test(ATC)
4.8.4 Package Shear/Pull Tests
4.8.5 Four-point Bending Test
4.8.6 Drop Test
4.9 Conclusions
References
Chapter 5 New Device Technologies for Green Micro/Nano Electronics
5.1 Overview
5.2 Dynamic Threshold Voltage Device and Adaptive Substrate Bias Technique
5.2.1 Dynamic Threshold Voltage MOS(DTMOS)Device with Gate-Body Connected
5.2.2 Adaptive Substrate Bias Technique for Low Voltage Circuits
5.3 Nanoscale New-structual MOSFETs with Low Leakage Current
5.3.1 Ultra-Thin Body SOI and Quasi-SOI Device
5.3.2 Novel Double-Gate MOS Device
5.3.3 Gate-All-Around Silicon Nanowire MOS Device
5.4 Novel-Mechanism Based Low Power Devices with Ultra-Steep Subthreshold Slope
5.4.1 Tunneling Field Effect Transistor
5.4.2 Impact Ionization MOS Device
5.4.3 Suspended-Gate MOSFET and NEM Relay
Acknowledgements
References
Chapter 6 Nanoelectronics from the Bottom-up:Materials,Devices and Circuits
6.1 Introduction
6.2 Carbon nanotube-based Nanoelectronics
6.2.1 Geometry and Electronic Structure
6.2.2 Synthesis of Aligned Carbon Nanotubes
6.2.3 Nanoelectronic Devices
6.2.4 Carbon Nanotube-based Circuits
6.3 Graphene-based Nanoelectronics
6.3.1 Synthesis and Transfer of Graphene
6.3.2 Electronic Structures and Properties of Graphene
6.3.3 Graphene-based Nanoelectronic Devices
6.4 Molecular Electronics
6.4.1 Brief History of Molecular Electronics
6.4.2 Molecular Electronic Devices
6.4.3 Molecular Electronic Circuits
6.5 Atomic Scale Devices
6.5.1 Single-Atom Transistor
6.5.2 Atomic Switch
6.5.3 Applications of Atomic Scale Devices
6.6 Summary
Acknowledgements
References
Chapter 7 Green Memory Technology
7.1 Overview of Semiconductor Memory Technologies
7.1.1 State-of-art Memory Technologies Toward Scaling Limit
7.1.2 Emerging Semiconductor Memory Technologies
7.2 Resistive Random Access Memory(RRAM)
7.2.1 Principle and Mechanisms
7.2.2 RRAM Characteristics
7.2.3 RRAM Technology
7.3 Phase-change Random Access Memory(PCRAM)
7.4 Magic Random Access Memory(MRAM)
7.5 Summary
Acknowledgements
References
Chapter 8 Microelectromechanical/Nanoelectrome chanical Systems and Their Applications
8.1 Background of MEMS
8.1.1 Definition of MEMS
8.1.2 Features of MEMS
8.1.3 Nanoelectromechanical System
8.1.4 Influence and State of MEMS/NEMS
8.2 Silicon-based Micromachining
8.2.1 Surface Micromachining Technology
8.2.2 Bulk Micromachining
8.3 Nanomachining Technology
8.3.1 Nano Lithography Technology
8.3.2 Nanoimprint Lithography
8.3.3 Spacer Technology
8.3.4 Fabrication of Nano-forests Based on Oxygen Plasma Removal of Photoresist
8.3.5 Nanosphere Self-assembly and Etching Technology
8.4 Categories and Applications of MEMS
8.4.1 Micromechanical Sensors
8.4.2 Optical MEMS
8.4.3 Microfluidics
8.4.4 Micro/Nano Bio-sensors/Bio-chips/BioMEMS
8.4.5 Applications of Micro/Nano Technology in System
8.5 RF MEMS
8.5.1 MEMS Switch/Relay
8.5.2 MEMS Inductors
8.5.3 Tunable Capacitors
8.5.4 Micromechanical Resonators and Filters
8.6 Power MEMS
8.6.1 Power Generator
8.6.2 Micro Energy Harvesting System
8.6.3 Mechanical Vibration
8.7 Environmental MEMS
8.7.1 Atmospheric Environmental Monitoring
8.7.2 Water Environmental Monitoring
8.7.3 Environmental Monitoring of Soil
8.7.4 Pathogenic Factors Monitoring
8.8 Trends and Prospects
Acknowledgements
References
Chapter 9 Photovoltaic Materials and Applications
9.1 Renewable Energy
9.1.1 PV Market and Roadmap
9.1.2 PV Materials and Applications
9.2 Principle of Solar Cell
9.2.1 PV Effect
9.2.2 J-V Characteristics
9.2.3 Quantum Efficiency
9.2.4 J-V Setup
9.2.5 QE Setup
9.3 Si Wafer PV Technology
9.3.1 Si Wafer
9.3.2 c-Si and Mc-Si Solar Cells
9.4 High Efficiency III-V
9.4.1 Concentrated Solar Cells
9.4.2 Multi-junction Solar Cells
9.5 Thin-film PV Technologies
9.5.1 TCO Material
9.5.2 A-Si & Nc-Si
9.5.3 CdTe
9.5.4 CIGS
9.5.5 DSSC
9.5.6 OPV
9.6 Innovative PV Technologies
9.6.1 Light Management
9.6.2 Nano-wire Solar Cell
9.6.3 Hot Carriers
9.6.4 Q-dot and Multi Exciton Generation
9.6.5 Intermediate Band Gap Solar Cell
9.7 Summary
References
Chapter 10 Solid State Lighting
10.1 An Overview of Solid State Lighting
10.1.1 Basic Concepts of Solid State Lighting
10.1.2 Basic Principles of Solid State Lighting
10.1.3 History and Current Developments of LEDs
10.2 Major Techniques of Solid State Lighting
10.2.1 Epitaxy
10.2.2 Device Fabrication
10.2.3 Packaging
10.3 LED Substrates
10.3.1 Sapphire
10.3.2 SIC
10.3.3 Si
10.3.4 GaN
10.3.5 ZnO
10.3.6 AlN
10.4 LEDs of Different Colors
10.4.1 Red LEDs
10.4.2 Green LEDs
10.4.3 Blue LEDs
10.4.4 Ultraviolet and Deep Ultraviolet LEDs
10.5 Progresses in LED Research
10.5.1 GaN Epitaxy
10.5.2 LEDs Device Morphology
10.6 OLED and PLED
10.6.1 Basic Concepts
10.6.2 Advantages of OLED/PLED
10.6.3 Applications
10.6.4 OLED/PLED Technological Advances
10.6.5 OLED/PLED Structure Evolution
10.7 Outlook
References
Chapter 11 AMOLED Displays:Pixel Circuits and Driving Schemes
11.1 Introduction
11.2 Current Driving Schemes
11.2.1 Stability and Non-uniformity in Current
11.2.2 Dynamic Effects
11.2.3 Settling Time in CPPCs
11.2.4 Techniques to Improve Programming Times in CPPCs
11.3 Voltage Driving Schemes
11.3.1 Imperfect Compensation
11.4 External Compensation
11.4.1 General Block Diagram
11.4.2 Current-parator Based System
11.5 Conclusion and Outlook
References
Chapter 12 The Impact of Social Culture and Institutions on Green Micro/Nano Electronics
12.1 Connotation of Social Culture
12.1.1 The Medium of Culture
12.1.2 Culture Is a Reflection of the Economy
12.1.3 The Interaction between Culture and the Progress of Science and Technology
12.1.4 Soft Power of Culture
12.2 Guide to the Development of Green Micro/Nano Electronics by the Scientific Concept of Development
12.2.1 People-Centered Principle
12.2.2 Harmonious Coexistence with Nature
12.2.3 Development Environment with Harmony without Uniformity
12.2.4 Legal System,Rule by Law and Morality
12.3 Development of Green Micro/Nano Electronics Needs a Green Environment
12.3.1 Development of Science Needs a Peaceful Environment
12.3.2 Development of Science Needs a Harmonious Culture
12.3.3 Uniting and Cooperating,Letting Everyone Play a Role
12.3.4 Sharing Resources,Fully Using Our Equipment
12.3.5 Respecting Intellectual Property Rights
12.3.6 Paying Attention to Cultivating Personnel
References

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