具體描述
基本信息
書名：Protel2004實用教程---原理圖與PCB設計(第2版)
定價：39.00元
作者：榖樹忠,侯麗華,薑航
齣版社：電子工業齣版社
齣版日期：2009-03-01
ISBN：9787121083082
字數：
頁碼：
版次：1
裝幀：平裝
開本：16開
商品重量：0.459kg
編輯推薦
內容提要
本書以典型的應用示例為主綫，介紹Protel 2004電子設計自動化（EDA）軟件使用方法。
本書詳細講解Protel 2004軟件中原理圖設計、印製電路闆設計和電子電路仿真三大部分。全書共14章，其中，第l章為Protel 2004軟件綜述，第2章至第7章為原理圖設計部分，第8章介紹原理圖的層次設計方法，第9章至3章為印製電路闆設計部分，4章為電子電路仿真部分。
本書結構閤理、入門簡單、層次清楚、內容詳實，並附有習題，可作為大院校電子類、電氣類、計算機類、自動化類以及機電一體化類專業的EDA教材，也可作為廣大電子産品設計工程技術人員和電子製好者的參考用書。
目錄
章 Protel2004係統
1.1 Protel2004的組成與特點
1.1.1 Prowl2004的組成
1.1.2 Prowl2004的特點
1.2 Protel2004的運行環境
1.3 Protel2004的安裝與認證
1.3.1 Prowl2004的安裝
1.3.2 Protel2004的認證
1.4 Protel2004的界麵
1.4.1 Prowl2004的主菜單欄
1.4.2 Prowl2004的主頁
1.4.3 Protel2004的工作麵闆
1.5 工作麵闆的操作
1.5.1 麵闆的激活
1.5.2 麵闆的工作狀態
1.5.3 麵闆的選擇及狀態的轉換
1.6 Protel2004的項目
1.6.1 項目的打開和編輯
1.6.2 新項目的建立
1.6.3 項目與文件
1.6.4 關閉文件及工作窗口
1.7 Protel2004資源用戶化
1.7.1 編輯菜單
1.7.2 創建下拉菜單
1.7.3 刪除下拉菜單
1.7.4 恢復係統資源
1.8 設置係統參數
1.8.1 常規參數設置
1.8.2 視圖參數設置
1.8.3 透明效果設置
1.8.4 版本控製選項
1.8.5 備份選項設置
1.8.6 項目麵闆視圖設置
練習
第2章 原理圖編輯器及參數
2.1 啓動原理圖編輯器
2.1.1 從“Files”麵闆中啓動原理圖編輯器
2.1.2 從主頁Home中啓動原理圖編輯器
2.1.3 從主菜單中啓動原理圖編輯器
2.2 原理圖編輯器界麵介紹
2.3 原理圖編輯器常用菜單
2.3.1 “File”菜單
2.3.2 “View”菜單
2.3.3 “Project”菜單
2.3.4 “Help”菜單
2.3.5 “RightMouseClick”菜單
2.4 原理圖編輯器界麵配置
2.5 圖紙參數設置
2.5.1 圖紙規格設置
2.5.2 圖紙選項設置
2.5.3 圖紙柵格設置
2.5.4 自動捕獲電氣節點設置
2.5.5 快速切換柵格命令
2.5.6 填寫圖紙設計信息
2.6 原理圖編輯器係統參數設置
2.6.1 原理圖參數設置
2.6.2 圖形編輯參數設置
2.6.3 編譯器參數設置
2.6.4 自動變焦參數設置
2.6.5 常用圖件默認值參數設置
練習
第3章 原理圖設計實例
3.1 原理圖設計流程
3.2 原理圖的設計
3.2.1 創建一個項目
3.2.2 創建原理圖文件
3.2.3 加載元件庫
3.2.4 放置元件
3.2.5 放置導綫
3.2.6 放置電源端子
3.3 原理圖的編輯與調整
3.3.1 自動標識元件
3.3.2 快速自動標識元件和恢復標識
3.3.3 直接編輯元件字符型參數
……
第4章 原理圖元件庫的使用
第5章 原理圖設計常用工具
第6章 原理圖編輯常用方法
第7章 原理圖常用圖件及屬性
第8章 原理圖層次設計
第9章 PCB設計基礎
0章 PCB設計基本操作
1章 PCB編輯器及參數
2章 PCB設計實例
3章 PCB的設計規則
4章 電子電路仿真
參考文獻
作者介紹
文摘
序言
Modern PCB Design: From Conception to Fabrication Overview: This comprehensive guide delves into the intricate world of modern Printed Circuit Board (PCB) design, equipping readers with the knowledge and practical skills necessary to transform electronic concepts into tangible, functional circuits. Spanning the entire design lifecycle, from initial schematic capture to the final stages of fabrication and assembly, this book offers a detailed exploration of industry-standard tools, methodologies, and best practices. It caters to a broad audience, including aspiring electronics engineers, hobbyists seeking to elevate their projects, and seasoned professionals looking to refine their skills in an ever-evolving technological landscape. Key Areas Covered: Part 1: Foundations of PCB Design Understanding Electronic Schematics: The journey begins with a solid understanding of schematic diagrams, the universal language of electronic circuits. This section meticulously explains the principles of schematic capture, including component selection, symbol creation, netlist generation, and the critical importance of proper annotation and organization. Readers will learn to interpret complex schematics, identify potential issues, and efficiently translate conceptual designs into a format suitable for PCB layout. Key concepts like design hierarchies, modular design, and the use of libraries will be thoroughly examined. Introduction to PCB Design Software: A significant portion of the book is dedicated to familiarizing readers with powerful, industry-leading PCB design software suites. While specific software names may vary to ensure broad applicability and avoid proprietary limitations, the underlying principles and workflows remain consistent. The guide provides in-depth tutorials on navigating the user interface, creating projects, placing and routing components, and managing design constraints. Readers will learn to harness the capabilities of these tools to optimize their design process and achieve professional-level results. Emphasis is placed on understanding the interdependencies between schematic and layout environments. Component Selection and Footprint Management: The careful selection of electronic components is paramount to a successful PCB design. This section explores the criteria for choosing appropriate components based on functionality, performance, cost, and availability. Furthermore, it delves into the critical concept of component footprints – the physical representation of a component on the PCB. Readers will learn how to utilize existing footprint libraries, create custom footprints for unique components, and ensure accurate footprint placement to avoid manufacturing errors. The importance of considering component packaging and thermal characteristics will also be highlighted. Part 2: The PCB Layout Process Board Outline and Layer Stackup: The physical dimensions and layer structure of a PCB are fundamental to its performance and manufacturability. This section guides readers through defining the board outline, including considerations for enclosure integration and mechanical constraints. A detailed explanation of layer stackup is provided, covering the number and arrangement of signal, power, and ground planes. Readers will learn how to optimize layer assignments for signal integrity, impedance control, and electromagnetic compatibility (EMC). Different types of PCB materials and their properties will also be discussed. Component Placement Strategies: Effective component placement is a crucial step that significantly impacts signal integrity, routability, and thermal management. This section presents various placement strategies, including grouping related components, separating sensitive analog and noisy digital sections, and optimizing for signal flow. Readers will learn to identify critical components and place them strategically, considering factors such as heat dissipation, connector accessibility, and ease of assembly. The concept of design rules and their role in guiding placement decisions will be explored. Routing Techniques and Signal Integrity: Routing is the process of connecting components with conductive traces. This section offers a comprehensive exploration of routing techniques, from manual routing to utilizing the software's automated routing capabilities. Special attention is paid to achieving optimal trace widths, spacing, and lengths to minimize signal degradation. Critical concepts of signal integrity, such as impedance matching, termination, crosstalk, and return path analysis, are explained in detail. Readers will learn how to implement strategies to ensure the reliable transmission of high-speed signals, preventing data errors and ensuring system stability. Power and Ground Distribution: Proper power and ground distribution is essential for the stable operation of any electronic circuit. This section focuses on designing robust power and ground planes, utilizing decoupling capacitors effectively, and managing current demands. Readers will learn to implement strategies for minimizing voltage drops, reducing noise, and ensuring adequate current carrying capacity. The importance of proper grounding techniques for EMC compliance will also be emphasized. Design Rule Checking (DRC) and Verification: Before proceeding to fabrication, thorough design verification is paramount. This section details the process of running Design Rule Checks (DRC) to identify and rectify potential violations of manufacturing constraints, such as trace-to-trace spacing, drill hole sizes, and solder mask clearances. Readers will learn to interpret DRC reports, understand the implications of each violation, and implement necessary corrections to ensure the board can be manufactured reliably. Beyond DRC, other verification methods like layout vs. schematic (LVS) checks will also be discussed. Part 3: Advanced Design Considerations and Fabrication High-Speed Design Principles: As electronic devices become increasingly complex and operate at higher frequencies, advanced design techniques for high-speed signals become indispensable. This section delves into the nuances of designing for high-speed applications, including controlled impedance routing, differential pair routing, skew management, and the impact of vias and connectors on signal integrity. Readers will gain an understanding of the challenges associated with high-speed data transmission and learn practical methods to mitigate them. Differential Signaling and Impedance Control: This dedicated section provides an in-depth look at differential signaling, a technique crucial for combating noise and enabling higher data rates in modern interfaces. Readers will learn how to implement differential pair routing, calculate and control trace impedance, and understand the impact of routing geometry on differential signal performance. The use of specialized routing tools and methodologies for differential pairs will be covered. Electromagnetic Compatibility (EMC) and Signal Integrity for Robust Designs: EMC is a critical aspect of modern electronic design, ensuring that devices do not interfere with each other and are resilient to external electromagnetic disturbances. This section explores fundamental EMC principles, including the sources of electromagnetic interference (EMI) and strategies for mitigation. Readers will learn about shielding, filtering, grounding techniques, and the impact of PCB layout on EMC performance. The interconnectedness of EMC and signal integrity will be a recurring theme. Thermal Management on PCBs: Dissipating heat effectively is crucial for the reliability and longevity of electronic components. This section examines various thermal management strategies for PCBs, including the use of thermal vias, copper pours, heat sinks, and component placement for optimal airflow. Readers will learn to identify components that generate significant heat and implement appropriate solutions to prevent overheating and potential component failure. DFM (Design for Manufacturability) and DFA (Design for Assembly): Bridging the gap between design and production, this section emphasizes the importance of designing PCBs that are easily and cost-effectively manufactured and assembled. Readers will learn about common manufacturing limitations, solder mask considerations, drill tolerances, panelization, and component placement for automated assembly processes. Understanding DFM and DFA principles from the outset can significantly reduce production costs and improve yield. Generating Manufacturing Files (Gerbers, Drill Files, etc.): The final stage of the design process involves generating the necessary files for PCB fabrication and assembly. This section meticulously details the process of creating Gerber files, drill files, BOM (Bill of Materials), and pick-and-place files. Readers will learn to configure output settings, understand the format of these files, and ensure they meet the specifications required by PCB manufacturers and assembly houses. Understanding PCB Fabrication and Assembly Processes: To design effectively, an understanding of how PCBs are actually made is invaluable. This section provides an overview of the common PCB fabrication processes, from etching and drilling to plating and solder mask application. It also covers the typical assembly processes, including component placement, soldering (wave soldering, reflow soldering), and inspection. This knowledge allows designers to make informed decisions that optimize for manufacturability and reduce potential production issues. Conclusion: "Modern PCB Design: From Conception to Fabrication" is more than just a software manual; it is a comprehensive roadmap for aspiring and experienced designers alike. By mastering the principles and techniques outlined within its pages, readers will gain the confidence and proficiency to tackle complex PCB design challenges, bring their innovative electronic ideas to life, and contribute to the ever-advancing field of electronics. The emphasis on practical application, clear explanations, and an understanding of the entire design-to-manufacturing pipeline ensures that this guide will be an indispensable resource for anyone involved in the creation of modern electronic products.
