具体描述
基本信息
书名：Protel2004实用教程---原理图与PCB设计(第2版)
定价：39.00元
作者：谷树忠,侯丽华,姜航
出版社：电子工业出版社
出版日期：2009-03-01
ISBN：9787121083082
字数：
页码：
版次：1
装帧：平装
开本：16开
商品重量：0.459kg
编辑推荐
内容提要
本书以典型的应用示例为主线，介绍Protel 2004电子设计自动化（EDA）软件使用方法。
本书详细讲解Protel 2004软件中原理图设计、印制电路板设计和电子电路仿真三大部分。全书共14章，其中，第l章为Protel 2004软件综述，第2章至第7章为原理图设计部分，第8章介绍原理图的层次设计方法，第9章至3章为印制电路板设计部分，4章为电子电路仿真部分。
本书结构合理、入门简单、层次清楚、内容详实，并附有习题，可作为大院校电子类、电气类、计算机类、自动化类以及机电一体化类专业的EDA教材，也可作为广大电子产品设计工程技术人员和电子制好者的参考用书。
目录
章 Protel2004系统
1.1 Protel2004的组成与特点
1.1.1 Prowl2004的组成
1.1.2 Prowl2004的特点
1.2 Protel2004的运行环境
1.3 Protel2004的安装与认证
1.3.1 Prowl2004的安装
1.3.2 Protel2004的认证
1.4 Protel2004的界面
1.4.1 Prowl2004的主菜单栏
1.4.2 Prowl2004的主页
1.4.3 Protel2004的工作面板
1.5 工作面板的操作
1.5.1 面板的激活
1.5.2 面板的工作状态
1.5.3 面板的选择及状态的转换
1.6 Protel2004的项目
1.6.1 项目的打开和编辑
1.6.2 新项目的建立
1.6.3 项目与文件
1.6.4 关闭文件及工作窗口
1.7 Protel2004资源用户化
1.7.1 编辑菜单
1.7.2 创建下拉菜单
1.7.3 删除下拉菜单
1.7.4 恢复系统资源
1.8 设置系统参数
1.8.1 常规参数设置
1.8.2 视图参数设置
1.8.3 透明效果设置
1.8.4 版本控制选项
1.8.5 备份选项设置
1.8.6 项目面板视图设置
练习
第2章 原理图编辑器及参数
2.1 启动原理图编辑器
2.1.1 从“Files”面板中启动原理图编辑器
2.1.2 从主页Home中启动原理图编辑器
2.1.3 从主菜单中启动原理图编辑器
2.2 原理图编辑器界面介绍
2.3 原理图编辑器常用菜单
2.3.1 “File”菜单
2.3.2 “View”菜单
2.3.3 “Project”菜单
2.3.4 “Help”菜单
2.3.5 “RightMouseClick”菜单
2.4 原理图编辑器界面配置
2.5 图纸参数设置
2.5.1 图纸规格设置
2.5.2 图纸选项设置
2.5.3 图纸栅格设置
2.5.4 自动捕获电气节点设置
2.5.5 快速切换栅格命令
2.5.6 填写图纸设计信息
2.6 原理图编辑器系统参数设置
2.6.1 原理图参数设置
2.6.2 图形编辑参数设置
2.6.3 编译器参数设置
2.6.4 自动变焦参数设置
2.6.5 常用图件默认值参数设置
练习
第3章 原理图设计实例
3.1 原理图设计流程
3.2 原理图的设计
3.2.1 创建一个项目
3.2.2 创建原理图文件
3.2.3 加载元件库
3.2.4 放置元件
3.2.5 放置导线
3.2.6 放置电源端子
3.3 原理图的编辑与调整
3.3.1 自动标识元件
3.3.2 快速自动标识元件和恢复标识
3.3.3 直接编辑元件字符型参数
……
第4章 原理图元件库的使用
第5章 原理图设计常用工具
第6章 原理图编辑常用方法
第7章 原理图常用图件及属性
第8章 原理图层次设计
第9章 PCB设计基础
0章 PCB设计基本操作
1章 PCB编辑器及参数
2章 PCB设计实例
3章 PCB的设计规则
4章 电子电路仿真
参考文献
作者介绍
文摘
序言
Modern PCB Design: From Conception to Fabrication Overview: This comprehensive guide delves into the intricate world of modern Printed Circuit Board (PCB) design, equipping readers with the knowledge and practical skills necessary to transform electronic concepts into tangible, functional circuits. Spanning the entire design lifecycle, from initial schematic capture to the final stages of fabrication and assembly, this book offers a detailed exploration of industry-standard tools, methodologies, and best practices. It caters to a broad audience, including aspiring electronics engineers, hobbyists seeking to elevate their projects, and seasoned professionals looking to refine their skills in an ever-evolving technological landscape. Key Areas Covered: Part 1: Foundations of PCB Design Understanding Electronic Schematics: The journey begins with a solid understanding of schematic diagrams, the universal language of electronic circuits. This section meticulously explains the principles of schematic capture, including component selection, symbol creation, netlist generation, and the critical importance of proper annotation and organization. Readers will learn to interpret complex schematics, identify potential issues, and efficiently translate conceptual designs into a format suitable for PCB layout. Key concepts like design hierarchies, modular design, and the use of libraries will be thoroughly examined. Introduction to PCB Design Software: A significant portion of the book is dedicated to familiarizing readers with powerful, industry-leading PCB design software suites. While specific software names may vary to ensure broad applicability and avoid proprietary limitations, the underlying principles and workflows remain consistent. The guide provides in-depth tutorials on navigating the user interface, creating projects, placing and routing components, and managing design constraints. Readers will learn to harness the capabilities of these tools to optimize their design process and achieve professional-level results. Emphasis is placed on understanding the interdependencies between schematic and layout environments. Component Selection and Footprint Management: The careful selection of electronic components is paramount to a successful PCB design. This section explores the criteria for choosing appropriate components based on functionality, performance, cost, and availability. Furthermore, it delves into the critical concept of component footprints – the physical representation of a component on the PCB. Readers will learn how to utilize existing footprint libraries, create custom footprints for unique components, and ensure accurate footprint placement to avoid manufacturing errors. The importance of considering component packaging and thermal characteristics will also be highlighted. Part 2: The PCB Layout Process Board Outline and Layer Stackup: The physical dimensions and layer structure of a PCB are fundamental to its performance and manufacturability. This section guides readers through defining the board outline, including considerations for enclosure integration and mechanical constraints. A detailed explanation of layer stackup is provided, covering the number and arrangement of signal, power, and ground planes. Readers will learn how to optimize layer assignments for signal integrity, impedance control, and electromagnetic compatibility (EMC). Different types of PCB materials and their properties will also be discussed. Component Placement Strategies: Effective component placement is a crucial step that significantly impacts signal integrity, routability, and thermal management. This section presents various placement strategies, including grouping related components, separating sensitive analog and noisy digital sections, and optimizing for signal flow. Readers will learn to identify critical components and place them strategically, considering factors such as heat dissipation, connector accessibility, and ease of assembly. The concept of design rules and their role in guiding placement decisions will be explored. Routing Techniques and Signal Integrity: Routing is the process of connecting components with conductive traces. This section offers a comprehensive exploration of routing techniques, from manual routing to utilizing the software's automated routing capabilities. Special attention is paid to achieving optimal trace widths, spacing, and lengths to minimize signal degradation. Critical concepts of signal integrity, such as impedance matching, termination, crosstalk, and return path analysis, are explained in detail. Readers will learn how to implement strategies to ensure the reliable transmission of high-speed signals, preventing data errors and ensuring system stability. Power and Ground Distribution: Proper power and ground distribution is essential for the stable operation of any electronic circuit. This section focuses on designing robust power and ground planes, utilizing decoupling capacitors effectively, and managing current demands. Readers will learn to implement strategies for minimizing voltage drops, reducing noise, and ensuring adequate current carrying capacity. The importance of proper grounding techniques for EMC compliance will also be emphasized. Design Rule Checking (DRC) and Verification: Before proceeding to fabrication, thorough design verification is paramount. This section details the process of running Design Rule Checks (DRC) to identify and rectify potential violations of manufacturing constraints, such as trace-to-trace spacing, drill hole sizes, and solder mask clearances. Readers will learn to interpret DRC reports, understand the implications of each violation, and implement necessary corrections to ensure the board can be manufactured reliably. Beyond DRC, other verification methods like layout vs. schematic (LVS) checks will also be discussed. Part 3: Advanced Design Considerations and Fabrication High-Speed Design Principles: As electronic devices become increasingly complex and operate at higher frequencies, advanced design techniques for high-speed signals become indispensable. This section delves into the nuances of designing for high-speed applications, including controlled impedance routing, differential pair routing, skew management, and the impact of vias and connectors on signal integrity. Readers will gain an understanding of the challenges associated with high-speed data transmission and learn practical methods to mitigate them. Differential Signaling and Impedance Control: This dedicated section provides an in-depth look at differential signaling, a technique crucial for combating noise and enabling higher data rates in modern interfaces. Readers will learn how to implement differential pair routing, calculate and control trace impedance, and understand the impact of routing geometry on differential signal performance. The use of specialized routing tools and methodologies for differential pairs will be covered. Electromagnetic Compatibility (EMC) and Signal Integrity for Robust Designs: EMC is a critical aspect of modern electronic design, ensuring that devices do not interfere with each other and are resilient to external electromagnetic disturbances. This section explores fundamental EMC principles, including the sources of electromagnetic interference (EMI) and strategies for mitigation. Readers will learn about shielding, filtering, grounding techniques, and the impact of PCB layout on EMC performance. The interconnectedness of EMC and signal integrity will be a recurring theme. Thermal Management on PCBs: Dissipating heat effectively is crucial for the reliability and longevity of electronic components. This section examines various thermal management strategies for PCBs, including the use of thermal vias, copper pours, heat sinks, and component placement for optimal airflow. Readers will learn to identify components that generate significant heat and implement appropriate solutions to prevent overheating and potential component failure. DFM (Design for Manufacturability) and DFA (Design for Assembly): Bridging the gap between design and production, this section emphasizes the importance of designing PCBs that are easily and cost-effectively manufactured and assembled. Readers will learn about common manufacturing limitations, solder mask considerations, drill tolerances, panelization, and component placement for automated assembly processes. Understanding DFM and DFA principles from the outset can significantly reduce production costs and improve yield. Generating Manufacturing Files (Gerbers, Drill Files, etc.): The final stage of the design process involves generating the necessary files for PCB fabrication and assembly. This section meticulously details the process of creating Gerber files, drill files, BOM (Bill of Materials), and pick-and-place files. Readers will learn to configure output settings, understand the format of these files, and ensure they meet the specifications required by PCB manufacturers and assembly houses. Understanding PCB Fabrication and Assembly Processes: To design effectively, an understanding of how PCBs are actually made is invaluable. This section provides an overview of the common PCB fabrication processes, from etching and drilling to plating and solder mask application. It also covers the typical assembly processes, including component placement, soldering (wave soldering, reflow soldering), and inspection. This knowledge allows designers to make informed decisions that optimize for manufacturability and reduce potential production issues. Conclusion: "Modern PCB Design: From Conception to Fabrication" is more than just a software manual; it is a comprehensive roadmap for aspiring and experienced designers alike. By mastering the principles and techniques outlined within its pages, readers will gain the confidence and proficiency to tackle complex PCB design challenges, bring their innovative electronic ideas to life, and contribute to the ever-advancing field of electronics. The emphasis on practical application, clear explanations, and an understanding of the entire design-to-manufacturing pipeline ensures that this guide will be an indispensable resource for anyone involved in the creation of modern electronic products.
